Whether for air quality, safety or control, sensor applications have one common requirement: a reliable sensor component. AppliedSensor’s ability to micromachine sensor chips using standard silicon wafer technology allows us to produce consistently reliable sensors in high volumes for mass market applications.
Unique micromachined, low-power sensor design
AppliedSensor’s AS-MLV-P high-performance sensor component is highly sensitive to a broad range of volatile organic compounds for superior monitoring of indoor air quality. Produced using a combination of thin-film, thick-film and other patent-pending proprietary technologies developed by AppliedSensor, the AS-MLV-P component is available as a chip-on-board (COB) package including protective cap and diffusion membrane.
AS-MLV-P sensor components are fabricated using silicon technology. The heater and inter-digital electrode structures are placed on an approximately one micrometer-thin silicon nitride membrane to achieve the lowest possible power consumption. A highly reproducible sensitive layer is deposited over the inter-digital electrodes, forming a gas concentration-dependent conductivity.
AS-MLV-P is reflow capable and can be flow soldered or connected via the through-holes.